everything in a new light. applications ? high-speed communications ? sonet/atm, fddi ? datalinks & lans ? fiber optic sensors description high-speed ingaas photodiodes from perkinelmer optoelectronics are designed for use in oem fiber optic communications systems and high- speed receiver applications including trunk line, lan, fiber-in-the-loop and data communications. ceramic submount packages are available for easy integration into high-speed sonet, fddi, or datalink receiver modules, or as back-facet power monitors in laser diode modules. photodiodes are available in hermetic to-18 packages, or in connectorized receptacle packages with industry standard st, fc or sc connectors. these are designed for mating to either single or multimode fibers. photodiodes are also available in a fibered package with either single or multimode fiber pigtail, which can be terminated with either an st, fc or sc connector. receptacled and fibered packages use a ball-lens to-18 package to maximize coupling efficiency. all devices are planar passivated and feature proven high reliability mounting and contacting. an mttf of >10 9 hours (approximate- ly 105 years) at 50 o c has been demonstrated to date from standard production samples. quality and reliability perkinelmer optoelectronics is committed to supplying the highest quality product to our customers, and we are certified to meet iso-9001 and operate to mil-q-9858a and aqap-1 quality standards. process control is maintained through annual re- qualification of production units and includes extensive electrical, thermal and mechanical stress as well as an extended lifetest. in addition, every wafer lot is individually qualified to meet responsivity, capacitance and dark current specifications, and reliability is high-speed ingaas pin photodiodes c30616, c30637, C30617, c30618 demonstrated with an extended high temperature burn- in at 200 o c for 168 hours (v r = 10v), ensuring an mttf > 10 7 hours at 50 o c (e a = 0.7ev). finally, all production devices are screened with a 16 hour, 200 o c burn-in (v r = 10v) and tested to meet responsivity, spectral noise and dark current specifications. features 50, 75, 100, 350 m diameters high responsivity at 1300 and 1550nm low capacitance for high bandwidths (to 3.5ghz) available in various package options
figure 1: typical spectral responsivity vs wavelength. dotted line shows response in d2 package (silicon window) figure 2: typical capacitance vs operating voltage. note 1: ceramic submount. performance specifications (at v r = v op typical), 22? parameter c30616 c30637 min typ max min typ max units operating voltage 1 5 10 1 5 10 v breakdown voltage 25 100 25 100 v active diameter 50 75 m responsivity at 1300 nm ceramic (d1) 0.80 0.90 0.80 0.90 a/w responsivity at 1550 nm ceramic (d1) 0.85 0.95 0.85 0.95 a/w dark current < 1.0 2.0 < 1.0 2.0 na spectral noise current (10 khz, 1.0 hz) < 0.02 0.15 < 0.02 0.15 pa/ hz capacitance at v r = v op (typ) ceramic (d1) 0.35 0.55 0.40 0.60 pf rise/fall time (10% to 90%) 0.07 0.5 0.07 0.5 ns bandwidth (-3 db, r l = 50 ? ) 3.5 3.5 ghz available package types d1 d1 maximum ratings maximum forward current 10 10 ma power dissipation 100 100 mw storage temperature -60 125 -60 125 ? operating temperature -40 125 -40 125 ?
figure 3: typical dark current vs. voltage figure 4: typical dark current vs. temperature at v op = -5v. specifications (at v r = v op typical), 22? parameter C30617 c30618 min typ max min typ max units operating voltage 1 5 10 1 5 10 v breakdown voltage 25 100 25 80 v active diameter 100 350 m responsivity at 1300 nm ceramic (d1)/to-18 (d2) 0.80 0.90 0.80 0.90 a/w fiber (d6)/fc (d4)/st (d3)/sc (d5) 1 0.65 0.75 0.65 0.75 responsivity at 1550 nm ceramic (d1)/to-18 (d2) 0.85 0.95 0.85 0.95 a/w fiber (d6)/fc (d4)/st (d3)/sc (d5) 1 0.70 0.80 0.70 0.80 dark current < 1.0 2.0 2.0 5.0 na spectral noise current (10 khz, 1.0 hz) < 0.02 0.15 0.02 0.20 pa/ hz capacitance at v r = v op (typ) (d1),(d6),(d3),(d5) 0.6 0.8 4.0 6.0 pf to-18 (d2) 0.8 1.0 4.0 6.0 rise/fall time (10% to 90%) 0.07 0.5 0.5 1.0 ns bandwidth (-3 db, r l = 50 ? ) 3.5 0.75 ghz available package types d1, d2, d3, d4, d5, d6, d1, d2, d3, d4, d21 - maximum ratings maximum forward current 10 10 ma power dissipation 100 100 mw storage temperature 2 -60 125 -60 125 ? operating temperature 2 -40 125 -40 125 ? note 1. coupled from 62.5 fm, 0.28 na graded index multi-mode fiber using 1300 nm sled source. note 2. maximum storage and operating temperature for connectorized and fibered devices is +85?. c30618 C30617 c30637 c30616
figure 5: package d1: ceramic submount figure 6: package d2: to-18 low profile figure 7: package d3: st receptacle module figure 8: package d4: fc detector module figure 9: package d5: sc receptacle module figure 10: package d6: fibered detector module standard packages
figure 11: termination d8: st connector figure 12: termination d9: fc connector figure 13: termination d10: sc connector figure 14: package d21: to-18 ball-lens package standard packages
c30 # # #l m m m - xx - nn fiber termination st: fc: sc: connector connector connector fiber type (core/cladding/jacket in package type st: fc: sc: qc: cer: receptacle receptacle receptacle fibered -xx-nn ceramic lens type e: b: to-18, ceramic submount connector/fibered/ball lens chip type 616, 637, 617, 618 note: specific package types available for each photodiode are listed in the table of specifications. ordering guide for more information e-mail us at opto@perkinelmer.com or visit our web site at www.perkinelmer.com/opto all values are nominal; specifications subject to change without notice. perkinelmer optoelectronics 22001 dumberry road vaudreuil (qc) canada j7v 8p7 phone: (450) 424-3300 fax: (450) 424-3411 ?2000 perkinelmer, inc. all rights reserved. 0400 is a registered trademark of perkinelmer, inc. flat window, ceramic submount ball lens, to-18, stand alone or with fiber / connector
|
